操作簡單，建浴用量僅25~30%，且具有良好的密著性。It is easy to operating. To enhance adhesion of plating layer by using 25% to 30% of make-up solution volume.

用量3~5%，熱浸漬、電解皆可使用，即便是浸漬時間拉長也不會傷害到素材。Using 3% to 5% cleaner in hot dipping and electrolytic plating. No tendency to etch the surface of the metal during long periods of immersion.